Important Dates

Submission Deadline

December 20, 2017

December 11, 2017

Registration Deadline

December 25, 2017

Conference Dates

December 30-31, 2017


Paper Template (Download)

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The 2017 International Symposium on Advanced and Intelligent Manufacturing Technology (ISAIMT 2017)[2017年先进与智能制造技术国际学术会议] will be held on December 30-31, 2017 in Guangzhou, China. ISAIMT 2017 is to bring together innovative academics and industrial experts in the field of advanced and intelligent manufacturing technology to a common forum. The primary goal of the conference is to promote research and developmental activities in advanced and intelligent manufacturing technology and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in advanced and intelligent manufacturing technology and related areas.


All papers will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers of ISAIMT 2017 will be published in the conference proceedings, it will be submitted to EI Compendex and CPCI for indexing.


Conference Notice

Paper Submission Methods

Full Paper (Presentation and Publication)
Accepted full papers will be invited to give the oral presentation at the conference and be published in one of the Journals / conference proceeding.
Paper Template (Download)
* All submissions must not be less than 5 pages in length.

Latest News

  • October 30, 2017
    ISAIMT 2017 are sincerely inviting TPC and you are welcome to contact us for consultation! (Click)

Contact Information

The Secretary office of ISAIMT 2017 will collect contributions and finish daily organizing work. All paper review process will be completed by Program Committee Member and invited experts.
If you have any question, please feel free to contact our conference secretary.
Conference Secretary: Dr. Chen